Reactive nanofoil

Reactive nanofoil – Innovative, low-temperature soldering at innojoin

At innojoin, we rely on state-of-the-art joining technologies, including low-temperature soldering with reactive nanofoils, to join components quickly, precisely, and gently. These highly innovative foils consist of finely tuned metal layers that generate an exothermic reaction when activated, providing precise heat directly at the soldering point. This allows metal joints to be created without exposing the entire component to high temperatures.

The advantages of this technology are obvious: Local heat generation protects sensitive components such as electronic components, coatings, or thin-walled workpieces. At the same time, the precise energy input enables reproducible, high-quality solder joints that are mechanically resilient, electrically conductive, and durable.

Our expertise in handling reactive nanofoil at innojoin includes:

Low-temperature and controlled soldering processes that minimize material distortion and thermal stress
High-precision joining technology for complex geometries and delicate components
Fast process times with high repeatability
Flexibility with different metals, such as copper, nickel, or stainless steel

Low-temperature soldering with nanofilms is particularly suitable for applications in electronics, sensor technology, medical technology, and other high-tech areas where conventional soldering would generate too much heat. This innovative technology enables the creation of high-precision, resilient connections that preserve the integrity and functionality of the components.

At innojoin, we combine state-of-the-art materials science with in-depth process expertise to offer our customers tailor-made solutions in low-temperature soldering. Reactive nanofoils open up new possibilities for the manufacture, repair, and development of high-precision components—efficiently, safely, and reliably.